Big players are vying to enter the AI chip market, and numerous large-scale collaborations are emerging.
On July 24, 2026, NVIDIA reached a 1.5 billion US dollar strategic cooperation agreement with Amkor, the world's second-largest foundry. NVIDIA will make an advance payment to support Amkor's expansion of advanced packaging capacity in the US. The two parties will jointly develop packaging and testing technologies for next-generation AI chips. Amkor has already initiated the construction of an advanced packaging park with an investment of 7 billion US dollars in Arizona, and is expected to start production in 2028. This move indicates that the model of AI chip design companies locking in packaging capacity through advance payments is extending from TSMC to third-party foundry manufacturers, confirming the continuous high demand for global AI computing power.
On July 25, 2026, Samsung Electronics announced a strategic cooperation agreement with the US chip design company Broadcom, covering areas such as memory chips, wafer fabrication, and advanced packaging. It is expected that the cooperation scale will exceed 200 billion US dollars by 2030. Samsung will use 2-nanometer and below process technologies to fabricate next-generation communication chips for Broadcom. The two parties will also jointly develop next-generation storage products such as HBM. This cooperation will help Samsung narrow the gap with TSMC in the wafer fabrication field and consolidate its position in the AI semiconductor market.
